MOS25 12 to 50V 25A 3D Printer Heat Bed Power Expansion Module
Power expansion module for 3D printer heat bed control with MOSFET technology.
- Input Voltage Range: 12 to 50 VDC
- Cable Length: 30 cm
- Length: 70 mm
- Width: 45 mm
- Height: 35 mm
- Weight: 52 gm
Top Features:
- Large heat sink for high current operation without active cooling
- Compatible with Anet A8, A6, A2, RAMPS, MK8, RepRap 3D printers
- Unique snowflake heat sink design for efficient cooling
- Supports maximum current up to 30A for enhanced printer performance
The MOS25 3D Printer Heat Bed Power Expansion Module is designed with a power MOSFET to enable PID control of the heat bed, unlike DC-DC relays. It features an MKS MOSFET for RAMPS 1.4 Heating-Controller with a maximum current capacity of 25A, ensuring stable long-term operation. It is recommended not to exceed 25A current usage with this module.
For heat beds exceeding 150W power, an external high-power module is required to ensure proper functionality. The module offers good protection for connectors on the controller board from burning, especially when using a 12V power supply that may lead to excessive current flow.
The package includes 1 x MOS25 12 to 50V 25A 3D Printer Heat Bed Power Expansion Module and 1 x Connecting Cables.
*Images are for illustration only; actual product may vary.