×
Diamond Basket 5750 Heat Sink for TO-3
A small heat sink designed for TO-3 devices
- Size: 41.40x32.7x25 mm
- Material: Aluminium
- Surface: Black Anodized
- Suitable for: TO-3 package components
Top Features:
- Black anodized finish
- Diamond-shaped basket design
- Efficient cooling for TO-3 devices
Diamond Basket 5750 is a series of diamond-shaped basket board-level heat sinks specifically designed to efficiently cool TO-3 devices. These black anodized heat sinks are ideal for cooling off components, ICs, and more.
Package Includes: 1 x Aluminum Heatsink TO-3 Package for Transistor
*Images are for illustration only; actual product may vary.