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ACE 500gm SMD Solder Paste
Perfect for tricky surface mount components soldering with heat reflow process.
- Alloy: 63% Tin 37% Lead
- Melting Point: 183°C
- Microns: 25-45µm (approx.)
- Weight: 500gm
Features:
- Joint high intensity
- Good Immersion
- Neutral Ph70.3
- Store Under Refrigeration
ACE 500gm SMD Solder Paste is specially formulated for industrial use, ensuring high intensity joints and good immersion. With a neutral Ph70.3, it should be stored under refrigeration for optimal performance. This solder paste is excellent for continuous printing, offering superior wet-ability and a non-corrosive formula. Its uniform particle size distribution makes it ideal for tricky surface mount components soldering using the heat reflow process.
Package Includes: 1 x ACE 500gm SMD Solder Paste
* Images are for illustration only; actual product may vary.