ACE 1Kg Silicone Heat Sink Compound
A white paste silicone-based grease for improved thermal connection.
- Color: White
- Texture: Smooth
- Penetration, worked 0.1 mm: 280
- Bleed at 24 Hrs. @ 200 ° C: 0.2%
- Dropping Point ° C: +240
- Dielectric Strength: 115 Volts/mil
- Specific Gravity / Density: 2.78
- Insulation Resistivity: 3 x 10^4 mega ohm
- Thermal conductivity at 35 °C: 1 W/mK
- Weight: 1 kg
Top Features:
- Improves thermal connection
- Non-contaminating
- Efficient thermal transfer
- Long life expectancy
ACE 1Kg Silicone Heat Sink Compound is typically a white paste silicone-based grease-like material that improves the thermal connection between the processor and heat sink. A thin layer of this compound is spread between the two surfaces, greatly enhancing heat transfer and cooling efficiency. It is recommended for use with all electronic components such as power transistors, diodes, and resistors.
The compound is designed to meet the need for a non-contaminating and more efficient thermal transfer medium. It offers a life expectancy that exceeds that of all known types of electronic circuitry in both normal and extreme environments.
Usage Instructions: Use a wood stick to apply a small quantity of the thermal compound on the heat sink where contact is made with the processor. Spread the compound slightly on the heat sink to cover the contact area with a thin film. Attach the heat sink to the processor, ensuring to eliminate any air gap. The heat generated by the processor during operation will help disperse the compound evenly. Avoid over-applying the paste.
Package Includes: 1 x ACE 1Kg Silicone Heat Sink Compound
* Images are for illustration only; actual product may vary.